- Product category
-
Product name:ESD HDPE Compound
Product model:HDPE ESD Compound
Product brand:INCHR
Processing customized:ESD Plastic Compound
Product specification:Surface Resistivity 10^6~10^8 Ohms
Product description:ESD A 700
High Density Polyethylene (HDPE)
ESD Protection
Static Dissipative
PROPERTIES & AVERAGE VALUES OF INJECTION MOLDED SPECIMENS
PERMANENCEEnglish
SI Metric
ASTM
TESTSpecific Gravity
1.02
1.02
D 792
Molding Shrinkage
1/8 in (3.2 mm) section
0.0200 - 0.0300 in/in
2.00 - 3.00 %
D 955
MECHANICALImpact Strength, Izod
notched 1/8 in (3.2 mm) section
0.8 ft-lbs/in
43 J/m
D 256
unnotched 1/8 in (3.2 mm) section
No Break
No Break
D 4812
Tensile Strength
3200 psi
22 MPa
D 638
Tensile Elongation
> 10.0 %
> 10.0 %
D 638
Tensile Modulus
0.12 x 10^6 psi
827 MPa
D 638
Flexural Strength
4200 psi
29 MPa
D 790
Flexural Modulus
0.15 x 10^6 psi
1034 MPa
D 790
ELECTRICALVolume Resistivity
1000 - 9.9E+09 ohm.cm
1000 - 9.9E+09 ohm.cm
D 257
Surface Resistivity
1.0E+5 - 9.9E+11 ohm/sq
1.0E+5 - 9.9E+11 ohm/sq
D 257
ESD STM11.11Surface Resistance
1.0E+4 - 9.9E+10 ohm
1.0E+4 - 9.9E+10 ohm
ESD STM11.11
Static Decay
MIL-PRF-81705D, 5kV to 50 V, 12% RH
< 2.00 s
< 2.00 s
FTMS101C
4046.1PROPERTY NOTES
Data herein is typical and not to be construed as specifications.
Unless otherwise specified, all data listed is for natural or black colored materials. Pigments can affect properties.
GENERAL PROCESSING FOR INJECTION MOLDINGEnglish
SI Metric
Injection Pressure
10000 - 15000 psi
69 - 103 MPa
Melt Temperature
380 - 450 °F
193 - 232 °C
Mold Temperature
70 - 150 °F
21 - 66 °C
Drying
2 hrs @ 175 °F
2 hrs @ 79 °C
PROCESSING NOTES13 Nov 2007 LLM
This information is intended to be used only as a guideline for designers and processors of modified thermoplastics. Because design and processing is complex, a set solution will not solve all problems. Observation on a “trial and error” basis may be required to achieve desired results.
Data are obtained from specimens molded under carefully controlled conditions from representative samples of the compound described herein. Properties may be materially affected by molding techniques applied and by the size and shape of the item molded. No assurance can be implied that all molded articles will have the same properties as those listed.
Pre:NothingNext:ESD PC/ABS Compound